The Glass Core Substrate (GCS) is a glass-core substrate used in semiconductor chips by Dai Nippon Printing, a Japanese company. This is especially true now when more crystals are placed on the same substrate. The new technology should be the most appropriate for these purposes.
DNP's Glass Core Substrate uses High Density Glass Channels to provide higher conductive channels than traditional current solutions.
The glass core substrate is a glass sheet with many tiny through holes that are deposited onto the motherboard. Through them, the processor connects the semiconductor crystal to the contacts that connect directly to the motherboard. This was previously impossible to accomplish with traditional chip assembly techniques.
The new substrate is versatile and can be used to fabricate chips of different designs and performance, including those with very large substrates. The substrate must have a high aspect ratio of 9+ and sufficient adhesive properties for fine electrical wiring.
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